Invention Application
- Patent Title: Integrated Memory having Non-Ohmic Devices and Capacitors
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Application No.: US16721006Application Date: 2019-12-19
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Publication No.: US20210193663A1Publication Date: 2021-06-24
- Inventor: Pankaj Sharma , Muralikrishnan Balakrishnan
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L27/11502 ; H01L45/00 ; H01L49/00 ; H01L29/786 ; G11C11/22

Abstract:
Some embodiments include a memory cell having a non-ohmic device between a transistor source/drain region and a capacitor. Some embodiments include a memory cell having a transistor with a first source/drain region, a second source/drain region, and a channel region between the first and second source/drain regions. A capacitor is electrically coupled to the second source/drain region through a non-ohmic device. The non-ohmic device includes a non-ohmic-device-material which changes conductivity in response to an electrical property along the channel region. The non-ohmic-device-material has a high-resistivity-mode when the electrical property along the channel region is below a threshold level, and transitions to a low-resistivity-mode when the electrical property along the channel region meets or exceeds the threshold level. Some embodiments include a memory array.
Public/Granted literature
- US11043497B1 Integrated memory having non-ohmic devices and capacitors Public/Granted day:2021-06-22
Information query
IPC分类: