- 专利标题： MEMS Package, MEMS Microphone and Method of Manufacturing the MEMS Package
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申请号： US16745407申请日： 2020-01-17
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公开(公告)号： US20210227334A1公开(公告)日： 2021-07-22
- 发明人: Masashi Shiraishi , Hironobu Hayashi , Toyotaka Kobayashi
- 申请人： SAE Magnetics (H.K.) Ltd.
- 申请人地址： HK Hong Kong
- 专利权人： SAE Magnetics (H.K.) Ltd.
- 当前专利权人： SAE Magnetics (H.K.) Ltd.
- 当前专利权人地址： HK Hong Kong
- 主分类号： H04R19/04
- IPC分类号： H04R19/04 ; H04R19/00 ; B81B7/00 ; B81C1/00 ; H04R1/04 ; H04R31/00 ; H04R7/04
摘要：
A MEMS package has a MEMS chip, a package substrate which the MEMS chip is adhered, a chip cover which wraps the MEMS chip, and a pressure regulation film which is adhered to the front surface of the chip cover. The chip cover has a vent which is formed in a chip outside area, arranged outside than the MEMS chip, the pressure regulation film has a slit. The slit is arranged in the neighborhood of the vent and the vent is covered with the pressure regulation film.
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