发明申请
- 专利标题： PRINTING CHEMICAL MECHANICAL POLISHING PAD HAVING WINDOW OR CONTROLLED POROSITY
-
申请号： US17240934申请日： 2021-04-26
-
公开(公告)号： US20210245322A1公开(公告)日： 2021-08-12
- 发明人: Laxman Murugesh , Kadthala Ramaya Narendrnath
- 申请人： Applied Materials, Inc.
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 主分类号： B24B37/20
- IPC分类号： B24B37/20 ; B29C71/04 ; B29C67/20 ; B24B37/24
摘要：
A method of fabricating a polishing pad includes determining a desired distribution of voids to be introduced within a polymer matrix of a polishing layer of the polishing pad. Electronic control signals configured to be read by a 3D printer are generated which specify the locations where a polymer matrix precursor is to be deposited, and specify the locations of the desired distribution of voids where no material is to be deposited. A plurality of layers of the polymer matrix corresponding to the plurality of the first locations is successfully deposited with the 3D printer. Each layer of the plurality of layers of polymer matrix is deposited by ejecting a polymer matrix precursor from a nozzle. The polymer matrix precursor is solidified to form a solidified polymer matrix having the desired distribution of voids.
信息查询
