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公开(公告)号：US11161218B2
公开(公告)日：2021-11-02
申请号：US16252513
申请日：2019-01-18
摘要： A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.
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公开(公告)号：US20190118336A1
公开(公告)日：2019-04-25
申请号：US16227911
申请日：2018-12-20
IPC分类号： B24B37/30
摘要： An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.
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公开(公告)号：US09685356B2
公开(公告)日：2017-06-20
申请号：US13842044
申请日：2013-03-15
IPC分类号： H05B3/68 , H01L21/67 , H01L21/683 , H01J37/32
CPC分类号： H01L21/67109 , H01J37/32715 , H01L21/6831 , Y10T156/10 , Y10T279/23
摘要： A substrate support assembly comprises a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further comprises a protective layer metal bonded to an upper surface of the ceramic body, wherein the protective layer is a bulk sintered ceramic article.
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公开(公告)号：US11826875B2
公开(公告)日：2023-11-28
申请号：US17494631
申请日：2021-10-05
CPC分类号： B24B37/205 , B24B37/22 , B24B37/24
摘要： A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.
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公开(公告)号：US11417561B2
公开(公告)日：2022-08-16
申请号：US16752127
申请日：2020-01-24
IPC分类号： H01L21/687 , H01L21/67 , C23C16/458 , B33Y10/00 , B33Y80/00
摘要： An edge ring and process for fabricating an edge ring are disclosed herein. In one embodiment, an edge ring includes an annular body and a plurality of thermal breaks disposed within the annular body. The thermal breaks are disposed perpendicular to a center line of the annular body of the edge ring.
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公开(公告)号：US20210245322A1
公开(公告)日：2021-08-12
申请号：US17240934
申请日：2021-04-26
摘要： A method of fabricating a polishing pad includes determining a desired distribution of voids to be introduced within a polymer matrix of a polishing layer of the polishing pad. Electronic control signals configured to be read by a 3D printer are generated which specify the locations where a polymer matrix precursor is to be deposited, and specify the locations of the desired distribution of voids where no material is to be deposited. A plurality of layers of the polymer matrix corresponding to the plurality of the first locations is successfully deposited with the 3D printer. Each layer of the plurality of layers of polymer matrix is deposited by ejecting a polymer matrix precursor from a nozzle. The polymer matrix precursor is solidified to form a solidified polymer matrix having the desired distribution of voids.
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公开(公告)号：US20190152017A1
公开(公告)日：2019-05-23
申请号：US16252513
申请日：2019-01-18
IPC分类号： B24B37/20
摘要： A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.
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公开(公告)号：US20180319205A1
公开(公告)日：2018-11-08
申请号：US16036596
申请日：2018-07-16
IPC分类号： B44C1/22 , H01L21/321 , H01L21/306 , B24C1/06 , B24C1/04 , B24B37/04 , H01L21/683 , H01L21/304 , H01L21/461 , B24B37/26
CPC分类号： B44C1/221 , B24B37/042 , B24B37/26 , B24C1/04 , B24C1/06 , H01L21/304 , H01L21/30625 , H01L21/3212 , H01L21/461 , H01L21/6833
摘要： An electrostatic chuck includes a metal base plate, an electrostatic puck bonded to the metal base plate, and surface features on the surface of the electrostatic puck. The electrostatic puck includes an electrode embedded in the electrostatic puck. A surface of the electrostatic puck has a flatness of below 10 microns. The surface features include mesas and a sealing band around a perimeter of the electrostatic puck. The surface features have an average surface roughness of approximately 2-6 micro-inches. The corners of the surface features are not rounded.
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公开(公告)号：US20210245323A1
公开(公告)日：2021-08-12
申请号：US17240917
申请日：2021-04-26
IPC分类号： B24B37/30
摘要： An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.
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公开(公告)号：US10213894B2
公开(公告)日：2019-02-26
申请号：US15054849
申请日：2016-02-26
IPC分类号： B24B37/20
摘要： A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.
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