Invention Application
- Patent Title: Floor underlayment
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Application No.: US17023554Application Date: 2020-09-17
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Publication No.: US20210246670A1Publication Date: 2021-08-12
- Inventor: Mikko Järvinen , Hannu Kainulainen , Seppo Laikko , Jukka Mälkönen
- Applicant: Jackon Finland Oy
- Applicant Address: FI Sastamala
- Assignee: Jackon Finland Oy
- Current Assignee: Jackon Finland Oy
- Current Assignee Address: FI Sastamala
- Priority: EP20156060.4 20200207
- Main IPC: E04F15/20
- IPC: E04F15/20 ; E04B1/62 ; B32B5/16 ; B32B27/32 ; B32B5/18 ; B32B27/06 ; B32B27/30 ; B32B27/14

Abstract:
The invention relates to a floor underlayment comprising a first layer, a second layer, and an inner layer between the first layer and the second layer, wherein the inner layer has one layer of foam beads, and the floor underlayment has a thickness from 0.8 mm to 1.5 mm. The invention further relates to a method for manufacturing a floor underlayment, a flooring system and a use of a floor underlayment.
Public/Granted literature
- US11220827B2 Floor underlayment Public/Granted day:2022-01-11
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