- 专利标题: INTEGRATED CIRCUIT DESIGN METHOD, SYSTEM AND COMPUTER PROGRAM PRODUCT
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申请号: US17245130申请日: 2021-04-30
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公开(公告)号: US20210248297A1公开(公告)日: 2021-08-12
- 发明人: Wan-Yu LO , Kuo-Nan YANG , Chin-Shen LIN , Chung-Hsing WANG
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 主分类号: G06F30/392
- IPC分类号: G06F30/392 ; G06F30/398
摘要:
In a method, cell placement is performed to place a plurality of cells into a region of an integrated circuit (IC). A thermal analysis is performed to determine whether the region of the IC is thermally stable at an operating condition. In response to a determination that the region of the IC is thermally unstable, at least one of a structure or the operating condition of the region of the IC is changed. After the thermal analysis, routing is performed to route a plurality of nets interconnecting the placed cells. At least one of the cell placement, the thermal analysis, the changing or the routing is executed by a processor.
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