A molded assembly, a camera module, a jointed board of molded assembly, and a manufacturing method are provided. The molded assembly includes a circuit board and a molded portion, wherein the circuit board has a molding region, a mounting region and at least two pad regions, the molding region surrounds the mounting region, the pad regions are arranged at corners of the circuit board and located outside corresponding corners of the molding region so as to electrically connect to an actuator, and the pad region has an avoidance boundary, and an angle formed by the avoidance boundary is greater than 90 degrees; wherein the molded portion embeds the molding region, surrounds the mounting region, and has a light window, and the molded portion avoids the pad regions along the avoidance boundary so as to reduce defective rate during production.