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公开(公告)号：US20220360694A1
公开(公告)日：2022-11-10
申请号：US17750743
申请日：2022-05-23
发明人： Zhen HUANG , Qimin MEI , Bojie ZHAO , Zhewen MEI , Li LIU , Jiawei CHEN , Zongchun YANG , Chenxiang XU
摘要： A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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公开(公告)号：US20210195074A1
公开(公告)日：2021-06-24
申请号：US17195816
申请日：2021-03-09
发明人： Zhen HUANG , Qimin MEI , Bojie ZHAO , Zhewen MEI , Li LIU , Jiawei CHEN , Zongchun YANG , Chenxiang XU
IPC分类号： H04N5/225
摘要： A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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3.发明公开公开(公告)号：US20230300442A1
公开(公告)日：2023-09-21
申请号：US18203252
申请日：2023-05-30
发明人： Mingzhu WANG , Bojie ZHAO , Takehiko TANAKA , Feifan CHEN , Qimin MEI , Liang DING , Heng JIANG
IPC分类号： H04N23/57 , H01L27/146 , H04N13/239 , H04N23/45 , H04N23/51 , H04N23/54 , H04N23/55
CPC分类号： H04N23/57 , H01L27/14618 , H01L27/14636 , H01L27/14634 , H01L27/1469 , H04N13/239 , H04N23/45 , H04N23/51 , H04N23/54 , H04N23/55 , H01L2224/48091 , H04N2213/001
摘要： A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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公开(公告)号：US20210250477A1
公开(公告)日：2021-08-12
申请号：US17195785
申请日：2021-03-09
发明人： Zhen HUANG , Qimin MEI , Bojie ZHAO , Zhewen MEI , Li LIU , Jiawei CHEN , Zongchun YANG , Chenxiang XU
IPC分类号： H04N5/225
摘要： A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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5.发明申请公开(公告)号：US20190297236A1
公开(公告)日：2019-09-26
申请号：US16436934
申请日：2019-06-11
发明人： Mingzhu WANG , Bojie Zhao , Takehiko Tanaka , Feifan CHEN , Qimin MEI , Liang DING , Heng JIANG
IPC分类号： H04N5/225 , H01L27/146 , H04N13/239
摘要： A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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6.发明公开公开(公告)号：US20230328350A1
公开(公告)日：2023-10-12
申请号：US18203731
申请日：2023-05-31
发明人： Zhen HUANG , Qimin MEI , Bojie ZHAO , Zhewen MEI , Li LIU , Jiawei CHEN , Chenxiang XU
CPC分类号： H04N23/55 , B29C43/18 , H04N23/54 , H04N23/57 , B29L2011/00
摘要： A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.
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公开(公告)号：US20220345602A9
公开(公告)日：2022-10-27
申请号：US16919065
申请日：2020-07-01
发明人： Mingzhu WANG , Bojie ZHAO , Takehiko Tanaka , Feifan CHEN , Qimin MEI , Liang DING , Heng JIANG
IPC分类号： H04N5/225 , H01L27/146 , H04N13/239
摘要： A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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公开(公告)号：US20220224808A1
公开(公告)日：2022-07-14
申请号：US16497433
申请日：2018-03-22
发明人： Mingzhu WANG , Shoujie WANG , Nan GUO , Liang DING , Bojie ZHAO , Feifan CHEN , Chunmei LIU , Qimin MEI
摘要： A split lens includes a first lens group including a first set of lenses, a second lens group including a second set of lenses, and at least one light shielding element. The light shielding element is disposed between the lens at the bottom position of the first lens group and the lens at the top position of the second lens group, such that a predetermined light path is formed between the first lens group and the second lens group, thereby conforming to the structure of the split lens.
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公开(公告)号：US20210289112A1
公开(公告)日：2021-09-16
申请号：US17262359
申请日：2019-06-28
发明人： Zhewen MEI , Qimin MEI , Bojie ZHAO
摘要： A molded assembly, a camera module, a jointed board of molded assembly, and a manufacturing method are provided. The molded assembly includes a circuit board and a molded portion, wherein the circuit board has a molding region, a mounting region and at least two pad regions, the molding region surrounds the mounting region, the pad regions are arranged at corners of the circuit board and located outside corresponding corners of the molding region so as to electrically connect to an actuator, and the pad region has an avoidance boundary, and an angle formed by the avoidance boundary is greater than 90 degrees; wherein the molded portion embeds the molding region, surrounds the mounting region, and has a light window, and the molded portion avoids the pad regions along the avoidance boundary so as to reduce defective rate during production.
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10.发明申请公开(公告)号：US20170271390A1
公开(公告)日：2017-09-21
申请号：US15494413
申请日：2017-04-21
发明人： Mingzhu WANG , Bojie ZHAO , Takehiko TANAKA , Feifan CHEN , Qimin MEI , Liang DING , Heng JIANG , Nan GUO , Zhenyu CHEN , Zhewen MEI
IPC分类号： H01L27/146
CPC分类号： H01L27/14618 , H01L27/1462 , H01L27/14634 , H01L27/14636 , H01L27/14685 , H01L27/1469 , H04N5/2251 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H04N5/2258 , H04N13/239 , H04N2213/001
摘要： A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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