• 专利标题: TRIVALENT CHROMIUM PLATING SOLUTION AND CHROMIUM PLATING METHOD USING SAME
  • 申请号: US17257348
    申请日: 2019-07-02
  • 公开(公告)号: US20210317589A1
    公开(公告)日: 2021-10-14
  • 发明人: Madoka NAKAGAMIMasao HORIYuto MORIKAWA
  • 申请人: JCU CORPORATION
  • 申请人地址: JP Taito-ku
  • 专利权人: JCU CORPORATION
  • 当前专利权人: JCU CORPORATION
  • 当前专利权人地址: JP Taito-ku
  • 优先权: JP2018-126508 20180703
  • 国际申请: PCT/JP2019/026246 WO 20190702
  • 主分类号: C25D3/10
  • IPC分类号: C25D3/10 C25D3/06
TRIVALENT CHROMIUM PLATING SOLUTION AND CHROMIUM PLATING METHOD USING SAME
摘要:
A trivalent chromium plating solution containing a trivalent chromium compound, a complexing agent, a conductive salt, and a pH-buffering agent, and further containing an organic compound having 2-4 carbon atoms and three or more chloro groups, and a trivalent chromium plating method using the same provide a practical trivalent chromium plating with enhanced corrosion resistance as compared to the ordinary trivalent chromium plating.
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