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公开(公告)号：US20170369513A1
公开(公告)日：2017-12-28
申请号：US15699714
申请日：2017-09-08
申请人： JCU CORPORATION
发明人： Daisuke Sadohara , Kenichi Nishikawa , Yasutake Nemichi , Hisayuki Toda , Hiroki Yasuda , Shinsuke Takagi , Christopher Ernest John Cordonier
IPC分类号： C07F7/04 , C08G77/02 , C09D183/00
摘要： An object of the present invention is to provide a silicon oligomer having a novel function that has not been achieved by a conventional condensation product of water and a tetraalkoxysilane. Provided are a silicon oligomer represented by the following formula (I) and a production method therefor: wherein R1 to R10 each independently is an alkyl group or a hydroxyalkyl group, each having 1 to 4 carbon atoms; X1 to X3 each independently is a group represented by the following formula (II); n is 0 or 1; and m is an integer of 1 to 3 when n is 0, and m is 1 when n is 1: wherein A is an alkylene group having 2 to 4 carbon atoms which may be branched, and 1 is an integer of 1 to 3.
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公开(公告)号：US20150294894A1
公开(公告)日：2015-10-15
申请号：US14441648
申请日：2012-11-14
申请人： JCU CORPORATION
IPC分类号： H01L21/687 , C25D17/06 , C25D17/00
CPC分类号： H01L21/68721 , C25D17/001 , C25D17/06
摘要： A plating jig that can form a metal plating film simultaneously on both surfaces of a semiconductor wafer by one plating process. The plating jig includes a base section and a cover section that can hold a substrate to be plated, and a center section that holds the substrate between the base section and cover section; the base section, the cover section and the center section each having an annular portion having an opening at a center thereof; seal packings each having a conductive ring disposed thereon being attached to each of facing surfaces of the annular portions of the base section and the cover section; the substrate to be plated being disposed inside the opening of the center section; and the substrate to be plated being held from front and back surfaces thereof with the seal packings attached to the cover section and the center section.
摘要翻译： 一种电镀工具，其可以通过一次电镀工艺在半导体晶片的两个表面上同时形成金属电镀膜。 电镀夹具包括：基座部和能够容纳被镀基板的盖部，以及将基板保持在基部与盖部之间的中央部; 所述基部，所述盖部和所述中心部各自具有在其中心具有开口的环状部; 每个具有设置在其上的导电环的密封填料附接到基部和盖部的环形部分的相对表面中的每一个; 待镀覆的基板设置在中心部分的开口内; 并且被镀的基板的前表面和后表面被保持，密封填料附着到盖部分和中心部分。
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公开(公告)号：US20240337039A1
公开(公告)日：2024-10-10
申请号：US18688551
申请日：2022-09-27
申请人： JCU CORPORATION
发明人： Masahiro SAWA , Eriko SONE , Akinobu OHNO
摘要： A copper-plated film having enlarged crystals can be obtained with a simple operation using a method for enlarging copper crystal grains in a plated object. Such a method, may include: (a) electroplating an object to be plated in an electrolytic copper plating solution, which contains sulfuric acid, copper sulfate, chloride ions, a brightener, and a leveler, and in which the content of sulfuric acid is 200 g/L or more; and (b) subjecting the electroplated object to be plated to a heat treatment at 400° C. or lower.
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公开(公告)号：US11538664B2
公开(公告)日：2022-12-27
申请号：US16203294
申请日：2018-11-28
申请人： JCU CORPORATION
IPC分类号： H01J37/32 , H01L21/67 , H01J37/18 , H01L21/311
摘要： A substrate is held in a substrate holder and accommodated in a treatment chamber. A positive electrode panel is arranged opposite to a surface of the substrate. Process gas is sent from a blower panel, toward the positive electrode panel and the substrate. A positive electrode of a high-frequency power source is connected to the positive electrode panel, and a negative electrode of the high-frequency power source is connected to the blower panel, to apply a high-frequency voltage. The process gas passes between the positive electrode panel and the blower panel which is the negative electrode, so that plasma is generated. The generated plasma removes contaminants on the surface of the substrate.
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公开(公告)号：US20210172081A1
公开(公告)日：2021-06-10
申请号：US16770357
申请日：2018-12-12
申请人： JCU CORPORATION
发明人： Masao HORI , Madoka NAKAGAMI , Yuto MORIKAWA
IPC分类号： C25D3/06
摘要： A trivalent chromium plating solution having a high plating deposition rate and being practical is provided with a trivalent chromium plating solution containing a trivalent chromium compound, a complexing agent, potassium sulfate and ammonium sulfate as a conductive salt, a pH buffer, and a sulfur-containing organic compound, containing a carboxylic acid having two or more hydroxy groups and two or more carboxy groups or a salt thereof as the complexing agent, and containing a combination of saccharin or a salt thereof and a sulfur-containing organic compound having an allyl group as the sulfur-containing organic compound.
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公开(公告)号：US20190096637A1
公开(公告)日：2019-03-28
申请号：US16203294
申请日：2018-11-28
申请人： JCU CORPORATION
摘要： A substrate is held in a substrate holder and accommodated in a treatment chamber. A positive electrode panel is arranged opposite to a surface of the substrate. Process gas is sent from a blower panel, toward the positive electrode panel and the substrate. A positive electrode of a high-frequency power source is connected to the positive electrode panel, and a negative electrode of the high-frequency power source is connected to the blower panel, to apply a high-frequency voltage. The process gas passes between the positive electrode panel and the blower panel which is the negative electrode, so that plasma is generated. The generated plasma removes contaminants on the surface of the substrate.
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7.发明申请公开(公告)号：US20160214139A1
公开(公告)日：2016-07-28
申请号：US14915360
申请日：2013-08-28
发明人： Hiroyuki YOSHIDA , Shinsuke MOCHIZUKI , Hiroshi HIRAYAMA , Toshiyasu NAGAI , Yasutake NEMICHI , Daisuke SADOHARA , Katsumi SHIMODA , Kenichi NISHIKAWA
CPC分类号： B05D5/00 , B05D3/0254 , B05D5/06 , B05D7/14 , C23C22/00 , C23C22/83 , C23C28/3225 , C23C28/345 , C23C2222/10
摘要： An object is to provide a technique capable of forming a film having a dark black appearance and high corrosion resistance on a zinc plated component in a simple process, and a black coating film-forming vehicle component and/or fastening component that is obtained by: treating a surface of a zinc plated metal substrate with a black chemical conversion treatment agent containing trivalent chromium as an active ingredient, to form a black chemical conversion treatment film having an L value (brightness) of from 33 to 30; coating a black coating composition containing a black pigment in an amount of from 25 to 65% by weight in a thermosetting film-forming component and an alkoxysilane oligomer, on the black chemical conversion treatment film; and heat-curing the black coating composition thus coated.
摘要翻译： 本发明的目的是提供一种能够以简单的方法在镀锌组分上形成具有深黑色外观和高耐腐蚀性的膜的技术，以及通过以下步骤获得的黑色涂膜成膜载体组分和/或紧固组分： 用含有三价铬的黑色化学转化处理剂作为活性成分处理镀锌金属基材的表面，形成L值（亮度）为33〜30的黑色化学转化处理膜; 在黑色化学转化处理膜上，在热固性成膜组分和烷氧基硅烷低聚物中涂覆含有黑色颜料的黑色颜料的黑色涂料组合物，其含量为25至65％重量; 并对由此涂覆的黑色涂料组合物进行热固化。
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公开(公告)号：US20240279834A1
公开(公告)日：2024-08-22
申请号：US18567596
申请日：2022-05-18
申请人： JCU CORPORATION
发明人： Kana SHIBATA , Kenichi NISHIKAWA
摘要： An additive for a composite plating solution, containing non-conductive fine particles, nickel ions, and water. A method for preventing solidification of a precipitate of non-conductive fine particles in an additive for a composite plating solution, including incorporating nickel ions in an additive for a composite plating solution containing non-conductive fine particles and water.
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公开(公告)号：US20210317589A1
公开(公告)日：2021-10-14
申请号：US17257348
申请日：2019-07-02
申请人： JCU CORPORATION
发明人： Madoka NAKAGAMI , Masao HORI , Yuto MORIKAWA
摘要： A trivalent chromium plating solution containing a trivalent chromium compound, a complexing agent, a conductive salt, and a pH-buffering agent, and further containing an organic compound having 2-4 carbon atoms and three or more chloro groups, and a trivalent chromium plating method using the same provide a practical trivalent chromium plating with enhanced corrosion resistance as compared to the ordinary trivalent chromium plating.
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公开(公告)号：US20210130969A1
公开(公告)日：2021-05-06
申请号：US17146898
申请日：2021-01-12
申请人： JCU CORPORATION
IPC分类号： C25D3/12
摘要： Provided are a technique with which a satin-like appearance can be obtained in nickel-plating by a nickel-plating additive characterized by containing a benzethonium salt, a satin nickel-plating bath containing the same, and a satin nickel-plating method using the same.
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