- 专利标题: METHODS FOR FABRICATING THIN FILM III-V COMPOUND SOLAR CELL
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申请号: US17170133申请日: 2021-02-08
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公开(公告)号: US20210328093A1公开(公告)日: 2021-10-21
- 发明人: Noren Pan , Glen Hillier , Duy Phach Vu , Rao Tatavarti , Christopher Youtsey , David McCallum , Genevieve Martin
- 申请人: MICROLINK DEVICES, INC.
- 申请人地址: US IL Niles
- 专利权人: MICROLINK DEVICES, INC.
- 当前专利权人: MICROLINK DEVICES, INC.
- 当前专利权人地址: US IL Niles
- 主分类号: H01L31/18
- IPC分类号: H01L31/18 ; H01L31/0687
摘要:
The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
公开/授权文献
- US11901476B2 Methods for fabricating thin film III-V compound solar cell 公开/授权日:2024-02-13
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