- 专利标题: ARRAY SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND DISPLAY DEVICE
-
申请号: US16335453申请日: 2018-11-29
-
公开(公告)号: US20210343780A1公开(公告)日: 2021-11-04
- 发明人: Chunping LONG
- 申请人: BOE Technology Group Co., Ltd
- 申请人地址: CN Beijing
- 专利权人: BOE Technology Group Co., Ltd
- 当前专利权人: BOE Technology Group Co., Ltd
- 当前专利权人地址: CN Beijing
- 优先权: CN201810220601.1 20180316
- 国际申请: PCT/CN2018/118122 WO 20181129
- 主分类号: H01L27/15
- IPC分类号: H01L27/15 ; H01L33/62 ; H01L33/12 ; H01L33/38 ; H01L33/00 ; H01L27/12
摘要:
An array substrate includes a base substrate, a thin film transistor on the base substrate, including a gate electrode connected to a gate line, an active layer, a gate insulating layer insulating the gate electrode from the active layer, a first electrode connected to a data line, and a second electrode spaced apart from the first electrode, and a micro light emitting diode on the base substrate, including a first electrode, a first buffer layer, a light emitting layer, and a second electrode, which are stacked on top of each other. The first buffer layer is in a same layer as the active layer. The second electrode of the thin film transistor is connected to one of the first electrode of the micro light emitting diode or the second electrode of the micro light emitting diode.
公开/授权文献
信息查询
IPC分类: