- 专利标题: ADDITIVE MANUFACTURING
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申请号: US17401026申请日: 2021-08-12
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公开(公告)号: US20210370597A1公开(公告)日: 2021-12-02
- 发明人: Hou T. Ng , Alejandro Manuel De Pena
- 申请人: Hewlett-Packard Development Company, L.P.
- 申请人地址: US TX Spring
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Spring
- 主分类号: B29C64/291
- IPC分类号: B29C64/291 ; B33Y10/00 ; B33Y70/00 ; B29C64/165 ; B33Y30/00 ; B33Y40/00 ; B33Y50/02 ; B29C64/153 ; B29C64/188 ; B29C64/393
摘要:
In one example, a non-transitory processor readable medium with instructions thereon that when executed cause an additive manufacturing machine to inhibit build material in an overlying layer of build material from fusing with a first slice formed in an underlying layer of build material.
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