- 专利标题: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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申请号: US17330381申请日: 2021-05-25
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公开(公告)号: US20210375889A1公开(公告)日: 2021-12-02
- 发明人: Yushi SEKIGUCHI , Yasunobu HAYASHI , Tadayuki YAMAZAKI
- 申请人: ROHM CO., LTD.
- 申请人地址: JP Kyoto
- 专利权人: ROHM CO., LTD.
- 当前专利权人: ROHM CO., LTD.
- 当前专利权人地址: JP Kyoto
- 优先权: JP2020-091400 20200526
- 主分类号: H01L27/112
- IPC分类号: H01L27/112
摘要:
A semiconductor device includes: a semiconductor layer having a main surface; a first conductive type well region formed on a surface portion of the main surface of the semiconductor layer; a second conductive type source region formed on a surface portion of the well region; a second conductive type drain region formed on the surface portion of the well region at an interval from the source region; a planar gate structure formed on the main surface of the semiconductor layer so as to face a first conductive type channel region disposed between the source region and the drain region; and a memory structure disposed adjacent to a lateral side of the planar gate structure, and including an insulating film formed on the channel region and a charge storage film facing the channel region with the insulating film interposed between the charge storage film and the channel region.
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