Invention Application
- Patent Title: ECC IN INTEGRATED MEMORY ASSEMBLY
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Application No.: US16891336Application Date: 2020-06-03
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Publication No.: US20210383886A1Publication Date: 2021-12-09
- Inventor: Idan Alrod , Eran Sharon
- Applicant: SanDisk Technologies LLC
- Applicant Address: US TX Addison
- Assignee: SanDisk Technologies LLC
- Current Assignee: SanDisk Technologies LLC
- Current Assignee Address: US TX Addison
- Main IPC: G11C29/42
- IPC: G11C29/42 ; G11C29/18 ; G11C29/44

Abstract:
Technology for error correcting data stored in memory dies is disclosed. Codewords, which may contain data bits and parity bits, are stored on a memory die. The memory die is bonded to a control die through bond pads that allow communication between the memory die and the control die. The codewords are decoded at the control die based on the parity bits. If the control die successfully decodes a codeword, the control die may send the data bits but not the parity bits to a memory controller. By not sending the parity bits to the memory controller, substantial bandwidth is saved. Also, substantial power may be saved. For example, the interface between the control die and the memory controller could be a high speed interface.
Public/Granted literature
- US11482296B2 ECC in integrated memory assembly Public/Granted day:2022-10-25
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