发明申请
- 专利标题: PACKAGE
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申请号: US17287409申请日: 2019-10-31
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公开(公告)号: US20210388242A1公开(公告)日: 2021-12-16
- 发明人: Hidekazu TANAKA , Atsushi SONE , Tamio SHIKANO
- 申请人: YUPO CORPORATION
- 申请人地址: JP Chiyoda-ku, Tokyo
- 专利权人: YUPO CORPORATION
- 当前专利权人: YUPO CORPORATION
- 当前专利权人地址: JP Chiyoda-ku, Tokyo
- 优先权: JP2018-207615 20181102
- 国际申请: PCT/JP2019/042902 WO 20191031
- 主分类号: C09J11/08
- IPC分类号: C09J11/08 ; C09J151/08 ; B65D85/10 ; B65D5/66 ; B65D33/18 ; B65D83/08 ; B65D5/38 ; B65D77/10
摘要:
The present disclosure is directed to provide a package which enables repeated opening and sealing of an opening, and can be favorably closed by bringing a pair of resin adhesive parts into contact with each other while preventing sticking of materials to each resin adhesive part. A package of the present disclosure comprises a main body having an internal space and an opening in communication between the internal space and an outside; and a pair of, i.e., two, resin adhesive parts which are disposed so as to be capable of being brought into contact with each other for sealing the opening. Here, the 90-degree peel force between the pair of resin adhesive parts is 0.02 N or more, the coefficient of dynamic friction of each of the two resin adhesive parts is 1.50 or less, and the tack force of each of the two resin adhesive parts is 1.60 N or less.
公开/授权文献
- US11352529B2 Package 公开/授权日:2022-06-07