A module is provided with a substrate having a main surface, and each of one or more inductors that are disposed on the main surface of the substrate. A resin sealing portion seals the one or more inductors and covers the main surface of the substrate. A ground conductor is disposed on an outer peripheral side of the substrate with respect to entirety of the one or more inductors in a plan view. A plurality of linear conductors are disposed on the resin sealing portion. The plurality of linear conductors are disposed with gaps therebetween, such that the one or more inductors underlie at least one of the plurality of linear conductors in the plan view.