- 专利标题: ELECTRONIC COMPONENT
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申请号: US17482051申请日: 2021-09-22
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公开(公告)号: US20220005646A1公开(公告)日: 2022-01-06
- 发明人: Chan Yoon , Sang Soo Park , Hwi Dae Kim , Woo Chul Shin , Ji Hong Jo
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2019-0074972 20190624
- 主分类号: H01G2/22
- IPC分类号: H01G2/22 ; H01G4/232 ; H01G4/224 ; H01G4/12 ; H01G4/30
摘要:
An electronic component includes a capacitor body including a dielectric layer and first and second internal electrodes, and a first to sixth surfaces, the first and the second internal electrodes being exposed through the third and the fourth surfaces, respectively; first and second external electrodes respectively extending from the third and fourth surfaces of the body to a portion of the first surface and respectively connected to the first and second internal electrodes; a shielding layer comprising a cap portion disposed on the second surface of the capacitor body and a side wall portion disposed on the third, fourth, fifth and sixth surfaces of the capacitor body; and an insulating layer disposed between the capacitor body and the shielding layer. A lower portion of the capacitor body is exposed from the insulating layer and the shielding layer.
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