The present invention relates to improvements for the manufacturing of a wave-cut bag of polymeric film, more specifically a wave-cut bag with a body having improved shock, tear and puncture resistance. The polymeric film has an embossed pattern of a plurality of embossed regions that are comprised of a plurality of parallel, linear embosses. Further disclosed is a process for intermittently applying the embossed pattern to a collapsed tube of a blown film extrusion process. The collapsed tube with the intermittently applied embossed pattern is particularly well suited for constructing wave-cut trash bags with the embossed pattern applied to a central body of the wave-cut bags.