Invention Application
- Patent Title: SCALABLE MANUFACTURING OF COPPER NANOCOMPOSITES WITH UNUSUAL PROPERTIES
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Application No.: US17294266Application Date: 2019-11-14
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Publication No.: US20220018001A1Publication Date: 2022-01-20
- Inventor: Xiaochun Li , Chezheng Cao , Gongcheng Yao , Shuaihang PAN
- Applicant: The Regents of the University of California
- Applicant Address: US CA Oakland
- Assignee: The Regents of the University of California
- Current Assignee: The Regents of the University of California
- Current Assignee Address: US CA Oakland
- International Application: PCT/US2019/061485 WO 20191114
- Main IPC: C22C32/00
- IPC: C22C32/00 ; C22C1/10 ; C22C1/05
Abstract:
A copper-based nanocomposite includes a matrix including copper, and nanostructures dispersed in the matrix, wherein the nanocomposite has a yield strength of about 300 MPa or greater, and a ductility of about 5% or greater. Manufacturing methods of a copper-based nanocomposite are also provided.
Information query
