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公开(公告)号:US20220018001A1
公开(公告)日:2022-01-20
申请号:US17294266
申请日:2019-11-14
Applicant: The Regents of the University of California
Inventor: Xiaochun Li , Chezheng Cao , Gongcheng Yao , Shuaihang PAN
Abstract: A copper-based nanocomposite includes a matrix including copper, and nanostructures dispersed in the matrix, wherein the nanocomposite has a yield strength of about 300 MPa or greater, and a ductility of about 5% or greater. Manufacturing methods of a copper-based nanocomposite are also provided.