- 专利标题: Memory Cells And Methods Of Forming A Capacitor Including Current Leakage Paths Having Different Total Resistances
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申请号: US17496564申请日: 2021-10-07
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公开(公告)号: US20220028442A1公开(公告)日: 2022-01-27
- 发明人: Michael Mutch , Ashonita A. Chavan , Sameer Chhajed , Beth R. Cook , Kamal Kumar Muthukrishnan , Durai Vishak Nirmal Ramaswamy , Lance Williamson
- 申请人: Micron Technology, Inc.
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 主分类号: G11C11/22
- IPC分类号: G11C11/22 ; H01L49/02 ; H01L27/11502
摘要:
A memory cell comprises a capacitor comprising a first capacitor electrode having laterally-spaced walls, a second capacitor electrode comprising a portion above the first capacitor electrode, and capacitor insulator material between the second capacitor electrode and the first capacitor electrode. The capacitor comprises an intrinsic current leakage path from one of the first and second capacitor electrodes to the other through the capacitor insulator material. A parallel current leakage path is between the second capacitor electrode and the first capacitor electrode. The parallel current leakage path is circuit-parallel with the intrinsic current leakage path, of lower total resistance than the intrinsic current leakage path, and comprises leaker material that is everywhere laterally-outward of laterally-innermost surfaces of the laterally-spaced walls of the first capacitor electrode. Other embodiments, including methods, are disclosed.
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