Invention Application
- Patent Title: Curative Free Joint Sealant
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Application No.: US17455489Application Date: 2021-11-18
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Publication No.: US20220073784A1Publication Date: 2022-03-10
- Inventor: Michael Doherty , Nigel Sweeney , Brendan Kneafsey , David Condron , Frances Murphy
- Applicant: Henkel IP & Holding GmbH
- Applicant Address: DE Dusseldorf
- Assignee: Henkel IP & Holding GmbH
- Current Assignee: Henkel IP & Holding GmbH
- Current Assignee Address: DE Dusseldorf
- Priority: GB1907805.4 20190531
- Main IPC: C09D175/14
- IPC: C09D175/14 ; F16L15/04
Abstract:
A curative free sealant composition for sealing joints between male and female parts, the sealant composition comprising a solid resin component, a solid (meth)acrylate polyurethane component, and an ethoxylated bisphenol-A (meth)acrylate component.
Information query
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