An electronic device includes a multi-layer piezoelectric substrate including a carrier substrate, a layer of piezoelectric material disposed on a front side of the carrier substrate, and a back-side layer of material disposed on a rear side of the carrier substrate, the back-side layer of material having a coefficient of thermal expansion different than a coefficient of thermal expansion of the carrier substrate, and one or more acoustic wave devices disposed on a front side of the multi-layer piezoelectric substrate, the one or more acoustic wave devices exhibiting a lesser difference in temperature coefficient of frequency at respective resonant and antiresonant frequencies than in a substantially similar device lacking the back-side layer of material.