Invention Application
- Patent Title: FILM THICKNESS GAUGE BY NEAR-INFRARED HYPERSPECRAL IMAGING
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Application No.: US17419487Application Date: 2020-01-22
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Publication No.: US20220082371A1Publication Date: 2022-03-17
- Inventor: Xiaoyun Chen , Jin Wang , Michael M. Bishop , Christopher M. Thurber , Matthew Benedict , Hyunwoo Kim , Eric L. Marchbanks , Kurt W. Olson
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- International Application: PCT/US2020/014499 WO 20200122
- Main IPC: G01B11/06
- IPC: G01B11/06 ; B29C48/10 ; B29C48/00 ; B29C48/92

Abstract:
The present teachings include a method of measuring an entire film thickness. The method may include forming a polymeric film (10) and measuring the thickness of the film (10) with a camera (20) collecting spatial and spectral images of a plurality of points at one time. The camera may collect a line image from a line of the film. The camera may be a hyperspectral near-infrared camera. In analyzing raw data collected during the measuring step, fringes of the raw data may be corrected using a classical least squares analysis.
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