Invention Application
- Patent Title: Filter For Laminated Circuit Assembly
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Application No.: US17476606Application Date: 2021-09-16
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Publication No.: US20220083891A1Publication Date: 2022-03-17
- Inventor: John Martinis , Bob Benjamin Buckley , Xiaojun Trent Huang
- Applicant: Google LLC
- Applicant Address: US CA Mountain View
- Assignee: Google LLC
- Current Assignee: Google LLC
- Current Assignee Address: US CA Mountain View
- Main IPC: G06N10/00
- IPC: G06N10/00 ; G02B5/20

Abstract:
A laminated circuit assembly for filtering signals in one or more signal lines in, for instance, a quantum computing system is provided. In one example, the laminated circuit assembly includes one or more signal lines disposed within a substrate in a first direction. The laminated circuit assembly includes a dielectric portion of the substrate. The laminated circuit assembly includes a filter portion of the substrate extending in a first direction and containing a frequency absorbent material providing less attenuation to a first signal of a first frequency than to a second signal of a second, higher frequency. The filter portion is configured to attenuate infrared signals passing through the one or more signal lines.
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