公开(公告)号：US20220085527A1

公开(公告)日：2022-03-17

申请号：US17476755

申请日：2021-09-16

Applicant: Google LLC

Inventor： John Martinis ,  Bob Benjamin Buckley ,  Xiaojun Trent Huang

IPC: H01R12/61 ,  H01R43/02 ,  H05K1/02

Abstract: Interconnections for connecting flex circuit boards in classical and/or quantum computing systems can include a first flex circuit board having a removed portion that exposes one or more signal lines and a second flex circuit board having a removed portion that exposes one or more other signal lines. The flex circuit boards can be aligned at the removed portions to form a signal trace gap near the exposed signal lines. Exposed signal lines of the first flex circuit board can be coupled with exposed signal lines of the second flex circuit board. A ground support layer can be coupled to the first flex circuit board and the second flex circuit board along the same side. An isolation plate at least partially covering the signal trace gap can be coupled to the first flex circuit board and/or the second flex circuit board on a side opposite of the ground support layer.

公开(公告)号：US11923628B2

公开(公告)日：2024-03-05

申请号：US17476755

申请日：2021-09-16

Applicant: Google LLC

Inventor： John Martinis ,  Bob Benjamin Buckley ,  Xiaojun Trent Huang

IPC: H01R12/61 ,  G06N10/40 ,  G06N10/80 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/14 ,  H05K3/36 ,  H10N60/80

CPC classification number: H01R12/61 ,  H01R43/02 ,  H05K1/0281 ,  H05K1/023 ,  H05K1/09

Abstract: Interconnections for connecting flex circuit boards in classical and/or quantum computing systems can include a first flex circuit board having a removed portion that exposes one or more signal lines and a second flex circuit board having a removed portion that exposes one or more other signal lines. The flex circuit boards can be aligned at the removed portions to form a signal trace gap near the exposed signal lines. Exposed signal lines of the first flex circuit board can be coupled with exposed signal lines of the second flex circuit board. A ground support layer can be coupled to the first flex circuit board and the second flex circuit board along the same side. An isolation plate at least partially covering the signal trace gap can be coupled to the first flex circuit board and/or the second flex circuit board on a side opposite of the ground support layer.

公开(公告)号：US20240049392A1

公开(公告)日：2024-02-08

申请号：US18355199

申请日：2023-07-19

Applicant: Google LLC

Inventor： John Martinis ,  Bob Benjamin Buckley ,  Xiaojun Trent Huang

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K3/36

CPC classification number: H05K1/144 ,  H05K1/028 ,  H05K1/115 ,  H05K1/118 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/0939 ,  H05K2201/09481

Abstract: An interconnection for flex circuit boards used, for instance, in a quantum computing system are provided. In one example, the interconnection can include a first flex circuit board having a first side and a second side opposite the first side. The interconnection can include a second flex circuit board having a third side and a fourth side opposite the third side. The first flex circuit board and the second flex circuit board are physically coupled together in an overlap joint in which a portion of the second side for the first flex circuit board overlaps a portion of the third side of the flex circuit board. The interconnection can include a signal pad structure positioned in the overlap joint that electrically couples a first via in the first flex circuit board and a second via in the second flex circuit board.

公开(公告)号：US11751333B2

公开(公告)日：2023-09-05

申请号：US17476625

申请日：2021-09-16

Applicant: Google LLC

Inventor： John Martinis ,  Bob Benjamin Buckley ,  Xiaojun Trent Huang

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/02 ,  H05K3/36

CPC classification number: H05K1/144 ,  H05K1/028 ,  H05K1/115 ,  H05K1/118 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/0939 ,  H05K2201/09481

Abstract: An interconnection for flex circuit boards used, for instance, in a quantum computing system are provided. In one example, the interconnection can include a first flex circuit board having a first side and a second side opposite the first side. The interconnection can include a second flex circuit board having a third side and a fourth side opposite the third side. The first flex circuit board and the second flex circuit board are physically coupled together in an overlap joint in which a portion of the second side for the first flex circuit board overlaps a portion of the third side of the flex circuit board. The interconnection can include a signal pad structure positioned in the overlap joint that electrically couples a first via in the first flex circuit board and a second via in the second flex circuit board.

公开(公告)号：US20220087022A1

公开(公告)日：2022-03-17

申请号：US17476625

申请日：2021-09-16

Applicant: Google LLC

Inventor： John Martinis ,  Bob Benjamin Buckley ,  Xiaojun Trent Huang

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K3/36

Abstract: An interconnection for flex circuit boards used, for instance, in a quantum computing system are provided. In one example, the interconnection can include a first flex circuit board having a first side and a second side opposite the first side. The interconnection can include a second flex circuit board having a third side and a fourth side opposite the third side. The first flex circuit board and the second flex circuit board are physically coupled together in an overlap joint in which a portion of the second side for the first flex circuit board overlaps a portion of the third side of the flex circuit board. The interconnection can include a signal pad structure positioned in the overlap joint that electrically couples a first via in the first flex circuit board and a second via in the second flex circuit board.

公开(公告)号：US12207407B2

公开(公告)日：2025-01-21

申请号：US18355199

申请日：2023-07-19

Applicant: Google LLC

Inventor： John Martinis ,  Bob Benjamin Buckley ,  Xiaojun Trent Huang

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36

Abstract: An interconnection for flex circuit boards used, for instance, in a quantum computing system are provided. In one example, the interconnection can include a first flex circuit board having a first side and a second side opposite the first side. The interconnection can include a second flex circuit board having a third side and a fourth side opposite the third side. The first flex circuit board and the second flex circuit board are physically coupled together in an overlap joint in which a portion of the second side for the first flex circuit board overlaps a portion of the third side of the flex circuit board. The interconnection can include a signal pad structure positioned in the overlap joint that electrically couples a first via in the first flex circuit board and a second via in the second flex circuit board.

公开(公告)号：US12082335B2

公开(公告)日：2024-09-03

申请号：US17476612

申请日：2021-09-16

Applicant: Google LLC

Inventor： John Martinis ,  Xiaojun Trent Huang ,  Bob Benjamin Buckley

IPC: H05K1/02 ,  G06N10/00 ,  H03K5/01 ,  H05K1/09 ,  H05K1/11 ,  H05K3/06 ,  H05K3/18

CPC classification number: H05K1/0219 ,  G06N10/00 ,  H03K5/01 ,  H05K1/028 ,  H05K1/09 ,  H05K1/116 ,  H05K3/06 ,  H05K3/188 ,  H05K2201/0154

Abstract: A flex circuit board can be used in transmitting signals in a quantum computing system. The flex circuit board can include at least one dielectric layer and at least one superconducting layer disposed on a surface of the at least one dielectric layer. The at least one superconducting layer can include a superconducting material. The superconducting material can be superconducting at a temperature less than about 3 kelvin. The flex circuit board can have at least one metal structure electroplated onto the at least one superconducting layer.

公开(公告)号：US20230207507A1

公开(公告)日：2023-06-29

申请号：US18177876

申请日：2023-03-03

Applicant: Google LLC

Inventor： Zhimin Jamie Yao ,  Bob Benjamin Buckley

IPC: H01L23/00 ,  G06N10/00 ,  H01L25/16

CPC classification number: H01L24/13 ,  H01L24/81 ,  G06N10/00 ,  H01L25/16 ,  H01L2924/04941 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13113 ,  H01L2224/1312 ,  H01L2224/13144 ,  H01L2224/13179 ,  H01L2224/13147 ,  H01L2224/13117 ,  H01L2224/13139 ,  H01L2224/13109 ,  H01L2224/13105 ,  H01L2224/1357 ,  H01L2224/13666 ,  H01L2224/8112 ,  H01L2224/81203 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01041 ,  H01L2924/01029 ,  H01L2924/01048 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01031

Abstract: A quantum computing system can include a first substrate including one or more quantum control devices. The quantum computing system can include a second substrate including one or more quantum circuit elements. The quantum computing system can include one or more tin contact bonds formed on the first substrate and the second substrate. The tin contact bonds can bond the first substrate to the second substrate. The tin contact bonds can be or can include tin, such as a tin alloy.

公开(公告)号：US20220083893A1

公开(公告)日：2022-03-17

申请号：US17476655

申请日：2021-09-16

Applicant: Google LLC

Inventor： John Martinis ,  Bob Benjamin Buckley ,  Xiaojun Trent Huang

IPC: G06N10/00 ,  H01R12/78 ,  H01R12/79 ,  H05K1/18 ,  H05K1/02 ,  H05K7/20

Abstract: A quantum computing system can include one or more classical processors. The quantum computing system can include quantum hardware including one or more qubits. The quantum computing system can include a chamber mount configured to support the quantum hardware. The quantum computing system can include a vacuum chamber configured to receive the chamber mount and dispose the quantum hardware in a vacuum. The vacuum chamber can form a cooling gradient from an end of the vacuum chamber to the quantum hardware. The quantum computing system can include a plurality of flex circuit boards including one or more signal lines. Each of the plurality of flex circuit boards can be configured to transmit signals by the one or more signal lines through the vacuum chamber to couple the one or more classical processors to the quantum hardware.

公开(公告)号：US12218091B2

公开(公告)日：2025-02-04

申请号：US18177876

申请日：2023-03-03

Applicant: Google LLC

Inventor： Zhimin Jamie Yao ,  Bob Benjamin Buckley

IPC: H01L23/00 ,  G06N10/00 ,  H01L25/16

Abstract: A quantum computing system can include a first substrate including one or more quantum control devices. The quantum computing system can include a second substrate including one or more quantum circuit elements. The quantum computing system can include one or more tin contact bonds formed on the first substrate and the second substrate. The tin contact bonds can bond the first substrate to the second substrate. The tin contact bonds can be or can include tin, such as a tin alloy.