Invention Application
- Patent Title: SEMICONDUCTOR STRUCTURE
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Application No.: US17073392Application Date: 2020-10-18
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Publication No.: US20220084928A1Publication Date: 2022-03-17
- Inventor: Chun-Hung Chen , Ming-Tse Lin
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu City
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu City
- Priority: CN202010965238.3 20200915
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00 ; H01L23/64 ; H01L23/48 ; H01L21/768 ; H01L21/48 ; H01L27/01
Abstract:
A semiconductor structure is disclosed. The semiconductor structure includes an interposer substrate having an upper surface and a lower surface that is opposite to the upper surface. A guard ring is formed in the interposer substrate and surrounds a device region of the interposer substrate. At least a through-silicon via is formed in the interposer substrate. An end of the guard ring and an end of the through-silicon via that are near the upper surface of the interposer substrate are flush with each other.
Public/Granted literature
- US11482485B2 Semiconductor structure Public/Granted day:2022-10-25
Information query
IPC分类:
