Invention Application
- Patent Title: HEADPHONE EARCUP WITH ADSORPTIVE MATERIAL
-
Application No.: US17230792Application Date: 2021-04-14
-
Publication No.: US20220086561A1Publication Date: 2022-03-17
- Inventor: Christopher Wilk , Jarrett B. Lagler
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Main IPC: H04R1/28
- IPC: H04R1/28 ; H04R5/033
Abstract:
A headphone earcup comprising: a frame defining an acoustic cavity that is acoustically coupled to a driver; an earcup cushion coupled to the frame and surrounding the acoustic cavity; and an adsorbent member acoustically coupled to the acoustic cavity to cause an acoustic enlargement of the acoustic cavity.
Public/Granted literature
- US11671745B2 Headphone earcup with adsorptive material Public/Granted day:2023-06-06
Information query
IPC分类:
