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公开(公告)号：US11277679B1
公开(公告)日：2022-03-15
申请号：US17023246
申请日：2020-09-16
申请人： Apple Inc.
发明人： Jarrett B. Lagler , Michael B. Minerbi , Miikka O. Tikander , Lee M. Panecki , Trang Fisher , Esge Andersen , Eugene Whang , Ben Shaffer , Edward Siahaan , Daniel R. Bloom , Kitty Yung , Tyler A. Green , Krithika Elangovan , Sarah Gysbers , Michael Burello , Matthew Zaverl , Christopher A. Sandieson , Casey L. Baran
IPC分类号： H04R1/10
摘要： A headphone earcup including a frame defining a cavity dimensioned to surround an ear of a user; a damping component coupled to the frame and encircling the cavity; a wrap component that covers the damping component and defines a continuous acoustic opening around the cavity to acoustically connect the cavity to the damping component; and a cosmetic component that covers the wrap component and the continuous acoustic opening.
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公开(公告)号：US11665455B2
公开(公告)日：2023-05-30
申请号：US16901937
申请日：2020-06-15
申请人： Apple Inc.
发明人： Thanh P. Hua , Jarrett B. Lagler , Brian R. Twehues , Ethan L. Huwe , Mei Zhang
IPC分类号： H04R1/02
CPC分类号： H04R1/02 , H04R2410/07
摘要： An acoustic mesh comprising a first portion that is acoustically closed; and a second portion that surrounds the first portion and is acoustically open, wherein a surface area of the second portion is at least one percent a total surface area of the acoustic mesh.
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公开(公告)号：US20240080604A1
公开(公告)日：2024-03-07
申请号：US17901754
申请日：2022-09-01
申请人： Apple Inc.
CPC分类号： H04R1/1016 , H04R1/2823
摘要： An in-ear electronic device comprising: an enclosure that defines an enclosed space surrounding a microphone and an acoustic opening to an ambient environment surrounding the enclosure; an acoustic pathway having a first end that opens to the acoustic opening and a second end that opens to the microphone; and a protective membrane positioned between the second end of the acoustic channel and the microphone.
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公开(公告)号：US11688383B2
公开(公告)日：2023-06-27
申请号：US17460041
申请日：2021-08-27
申请人： Apple Inc.
IPC分类号： G10K11/178 , H04R1/10
CPC分类号： G10K11/17854 , G10K11/17821 , G10K11/17881 , H04R1/1016 , H04R1/1083 , G10K2210/1081 , H04R2460/01
摘要： A processor is configured to perform headphone playback with a playback audio signal. The processor produces a feedback signal from an internal microphone, compresses the feedback signal according to a variable compressor setting, and determines a context of usage of the headphone, as being one of running or jogging, transportation, and critical listening. In response, the processor changes the variable compressor setting and drives the headphone speaker with the compressed feedback signal combined with the playback audio signal. Other aspects are also described and claimed.
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公开(公告)号：US20230060353A1
公开(公告)日：2023-03-02
申请号：US17460041
申请日：2021-08-27
申请人： Apple Inc.
IPC分类号： G10K11/178 , H04R1/10
摘要： A processor is configured to perform headphone playback with a playback audio signal. The processor produces a feedback signal from an internal microphone, compresses the feedback signal according to a variable compressor setting, and determines a context of usage of the headphone, as being one of running or jogging, transportation, and critical listening. In response, the processor changes the variable compressor setting and drives the headphone speaker with the compressed feedback signal combined with the playback audio signal. Other aspects are also described and claimed.
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公开(公告)号：US20220086561A1
公开(公告)日：2022-03-17
申请号：US17230792
申请日：2021-04-14
申请人： Apple Inc.
摘要： A headphone earcup comprising: a frame defining an acoustic cavity that is acoustically coupled to a driver; an earcup cushion coupled to the frame and surrounding the acoustic cavity; and an adsorbent member acoustically coupled to the acoustic cavity to cause an acoustic enlargement of the acoustic cavity.
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公开(公告)号：US20220086551A1
公开(公告)日：2022-03-17
申请号：US17023246
申请日：2020-09-16
申请人： Apple Inc.
发明人： Jarrett B. Lagler , Michael B. Minerbi , Miikka O. Tikander , Lee M. Panecki , Trang Fisher , Esge Andersen , Eugene Whang , Ben Shaffer , Edward Siahaan , Daniel R. Bloom , Kitty Yung , Tyler A. Green , Krithika Elangovan , Sarah Gysbers , Michael Burello , Matthew Zaverl , Christopher A. Sandieson , Casey L. Baran
IPC分类号： H04R1/10
摘要： A headphone earcup including a frame defining a cavity dimensioned to surround an ear of a user; a damping component coupled to the frame and encircling the cavity; a wrap component that covers the damping component and defines a continuous acoustic opening around the cavity to acoustically connect the cavity to the damping component; and a cosmetic component that covers the wrap component and the continuous acoustic opening.
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公开(公告)号：US20210099778A1
公开(公告)日：2021-04-01
申请号：US16901937
申请日：2020-06-15
申请人： Apple Inc.
发明人： Thanh P. Hua , Jarrett B. Lagler , Brian R. Twehues , Ethan L. Huwe , Mei Zhang
IPC分类号： H04R1/02
摘要： An acoustic mesh comprising a first portion that is acoustically closed; and a second portion that surrounds the first portion and is acoustically open, wherein a surface area of the second portion is at least one percent a total surface area of the acoustic mesh.
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公开(公告)号：US12133038B2
公开(公告)日：2024-10-29
申请号：US17901751
申请日：2022-09-01
申请人： Apple Inc.
CPC分类号： H04R1/1016 , H04R1/2823
摘要： An in-ear electronic device comprising: an enclosure that defines an enclosed space surrounding a driver and an acoustic vent to an ambient environment surrounding the enclosure; and an acoustic frame having an outer surface coupled to the enclosure and defining an acoustic channel between a back volume chamber of the driver to the acoustic vent.
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公开(公告)号：US20240080603A1
公开(公告)日：2024-03-07
申请号：US17901751
申请日：2022-09-01
申请人： Apple Inc.
CPC分类号： H04R1/1016 , H04R1/2823
摘要： An in-ear electronic device comprising: an enclosure that defines an enclosed space surrounding a driver and an acoustic vent to an ambient environment surrounding the enclosure; and an acoustic frame having an outer surface coupled to the enclosure and defining an acoustic channel between a back volume chamber of the driver to the acoustic vent.
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