A method for producing a ceramic electronic component includes providing an outer electrode, which includes forming a baked electrode layer by applying an electrically conductive paste including an electrically conductive metal and glass such that the electrically conductive paste covers an exposed portion of an inner electrode on a ceramic body and baking the applied electrically conductive paste, and forming a plating film on the surface of the baked electrode layer by electroplating. The baked electrode layer includes metal portions and glass portions distributed in contact with the metal portions. After the formation of the baked electrode layer, the surface of the baked electrode layer is subjected to barrel or blast processing using a powder having a Mohs hardness equal to or lower than that of the ceramic body.