Invention Application
- Patent Title: METHOD OF MANUFACTURING ELECTRONIC DEVICE
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Application No.: US17482438Application Date: 2021-09-23
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Publication No.: US20220093558A1Publication Date: 2022-03-24
- Inventor: Yi-An CHEN , Wan-Ling HUANG , Tsau-Hua HSIEH
- Applicant: InnoLux Corporation
- Applicant Address: TW Miao-Li County
- Assignee: InnoLux Corporation
- Current Assignee: InnoLux Corporation
- Current Assignee Address: TW Miao-Li County
- Priority: CN202011008889.X 20200923,CN202111108666.5 20210922
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A method of manufacturing an electronic device is disclosed. An electronic unit is provided. The electronic unit has a chip and at least one bonding pin. The electronic unit is mounted on the substrate through the at least one bonding pin, and an adhesive material is applied to a space between the chip and the substrate.
Public/Granted literature
- US11742319B2 Method of manufacturing electronic device Public/Granted day:2023-08-29
Information query
IPC分类:
