- 专利标题: PRESSURE RELIEF VALVE FOR HEADPHONES
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申请号: US17405914申请日: 2021-08-18
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公开(公告)号: US20220095030A1公开(公告)日: 2022-03-24
- 发明人: Jacob A. Pfitsch , Onur I. Ilkorur , Esge B. Andersen , Miikka O. Tikander
- 申请人: Apple Inc.
- 申请人地址: US CA Cupertino
- 专利权人: Apple Inc.
- 当前专利权人: Apple Inc.
- 当前专利权人地址: US CA Cupertino
- 主分类号: H04R1/10
- IPC分类号: H04R1/10 ; H04R1/28
摘要:
A headphone comprising: two headphone earcups each comprising: an earcup housing defining an active chamber that acoustically couples a sound output side of a speaker to an ear of a user, and an inactive chamber that surrounds the active chamber; and a passive valve assembly configured to open in response to a positive pressure and a negative pressure within the active chamber to fluidly couple the active chamber to the inactive chamber and equalize a pressure between the active chamber and the inactive chamber.
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