PRESSURE RELIEF VALVE FOR HEADPHONES

    公开(公告)号:US20220095030A1

    公开(公告)日:2022-03-24

    申请号:US17405914

    申请日:2021-08-18

    申请人: Apple Inc.

    IPC分类号: H04R1/10 H04R1/28

    摘要: A headphone comprising: two headphone earcups each comprising: an earcup housing defining an active chamber that acoustically couples a sound output side of a speaker to an ear of a user, and an inactive chamber that surrounds the active chamber; and a passive valve assembly configured to open in response to a positive pressure and a negative pressure within the active chamber to fluidly couple the active chamber to the inactive chamber and equalize a pressure between the active chamber and the inactive chamber.

    LOUDSPEAKER DEVICE
    2.
    发明申请
    LOUDSPEAKER DEVICE 审中-公开

    公开(公告)号:US20200154184A1

    公开(公告)日:2020-05-14

    申请号:US16733841

    申请日:2020-01-03

    申请人: Apple Inc.

    摘要: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.