Invention Application
- Patent Title: STORING MANUFACTURING CONDITIONS WHILE 3D PRINTING
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Application No.: US17415079Application Date: 2019-06-18
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Publication No.: US20220097308A1Publication Date: 2022-03-31
- Inventor: Kristopher J. Erickson , Jarrid Wittkopf , Rafael Ballagas , David Wayne George , Lihua Zhao , William J. Allen
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- International Application: PCT/US2019/037645 WO 20190618
- Main IPC: B29C64/386
- IPC: B29C64/386 ; B33Y50/00 ; B33Y10/00 ; B33Y30/00

Abstract:
In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. A placement device is to embed a storage element into the 3D printed object and a controller is to write data to the embedded storage element that relates to manufacturing conditions of the 3D printed object.
Information query