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公开(公告)号:US11904537B2
公开(公告)日:2024-02-20
申请号:US17824197
申请日:2022-05-25
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Kristopher J. Erickson , Lihua Zhao
IPC: B29C64/165 , B29C64/295 , B29C64/209 , B29C64/268 , B33Y10/00 , B33Y70/00 , B33Y30/00
CPC classification number: B29C64/165 , B29C64/209 , B29C64/268 , B29C64/295 , B33Y70/00 , B33Y10/00 , B33Y30/00
Abstract: A system for forming a multiple layer object, the system including: a spreader to form a layer of polymer particles, the polymer particles having a melting temperature (Tm) of at least 250° C.; a fluid ejection head to selectively deposit a first fusing agent on a first portion of the layer and selectively deposit a second fusing agent on a second portion of the layer, wherein the fluid ejection head does not deposit the fusing agent on a third portion of the layer; and a heat source to heat the first portion and second portion, wherein the first portion is part of the multiple layer object and the second portion is not part of the multiple layer object and the second portion raises a temperature of polymer particles in a subsequent layer.
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公开(公告)号:US20240042680A1
公开(公告)日:2024-02-08
申请号:US18379071
申请日:2023-10-11
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Paul Olubummo , Kristopher J. Erickson , Aja Hartman , Lihua Zhao
IPC: B29C64/124 , B33Y10/00 , B33Y30/00 , B33Y70/00 , B29C64/314 , B29C64/165 , B29C64/218 , B33Y40/10
CPC classification number: B29C64/124 , B33Y10/00 , B33Y30/00 , B33Y70/00 , B29C64/314 , B29C64/165 , B29C64/218 , B33Y40/10
Abstract: In an example, a three-dimensional (3D) printed part comprises a plurality of fused build material layers including exterior layers and interior layers. At least some of the interior layers include a composite portion having a miscible solid physically bonded to an amide functionality or an amine functionality of the build material. The miscible solid is a solid at a room temperature ranging from about 18° C. to about 25° C.
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公开(公告)号:US11850791B2
公开(公告)日:2023-12-26
申请号:US15764765
申请日:2016-01-20
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: David George , Chandrakant Patel , Lihua Zhao , Michael Renne Ty Tan
IPC: B29C64/153 , B33Y30/00 , B33Y50/02 , B33Y10/00 , B29C64/393 , B29C64/165 , B29C64/277 , B29C64/264 , H01S5/183
CPC classification number: B29C64/153 , B29C64/165 , B29C64/264 , B29C64/277 , B29C64/393 , B33Y10/00 , B33Y30/00 , B33Y50/02 , H01S5/18355
Abstract: In one example, a device for printing a three-dimensional object is described. The device may include at least one material application unit to deposit at least one material for a voxel of the three-dimensional object, a vertical cavity surface emitting laser array comprising a plurality of vertical cavity surface emitting lasers, the plurality of vertical cavity surface emitting lasers including a first vertical cavity surface emitting laser to operate at a first wavelength and a second vertical cavity surface emitting laser to operate at a second wavelength, and a processor to control a deposition of the at least one material for the voxel via the at least one material application unit and to control an application of electromagnetic energy via at least one of the plurality of vertical cavity surface emitting lasers to the voxel to alter at least one property of the at least one material.
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公开(公告)号:US11759996B2
公开(公告)日:2023-09-19
申请号:US16978869
申请日:2018-04-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Kristopher J. Erickson , Anthony McLennan , Lihua Zhao
IPC: B29C64/106 , B29C64/264 , B29C64/188 , B22F12/13 , B22F12/30 , B22F10/64 , B22F1/054 , B33Y10/00 , B33Y30/00 , B33Y40/20 , B22F10/25 , B22F10/28 , B22F10/39
CPC classification number: B29C64/106 , B22F1/054 , B22F10/64 , B22F12/13 , B22F12/30 , B29C64/188 , B29C64/264 , B22F10/25 , B22F10/28 , B22F10/39 , B33Y10/00 , B33Y30/00 , B33Y40/20
Abstract: An example system includes a three-dimensional (3D) printer to generate a 3D object and a surface feature formation arrangement to receive the 3D object. The 3D object has at least one surface with a layer of at least partly uncured material. The surface feature formation arrangement includes a controller and a heat source. The controller is to operate the heat source to selectively apply heat to the at least one surface of the 3D object. The heat from the heat source is to transform the at least partly uncured material to form a selected feature on the at least one surface.
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公开(公告)号:US11673332B2
公开(公告)日:2023-06-13
申请号:US17256676
申请日:2019-03-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Aja Hartman , Lihua Zhao , David Woodlock , Lee Dockstader
IPC: G05B19/4099 , B29C64/386 , B33Y50/00 , B22F10/80 , G06F30/10 , G06F113/10
CPC classification number: B29C64/386 , B22F10/80 , B33Y50/00 , G05B19/4099 , G05B2219/35012 , G05B2219/45028 , G06F30/10 , G06F2113/10
Abstract: In an example, a method includes operating, by a processor, on object model data. The object model data describes at least part of an object to be generated in additive manufacturing. The method also includes determining, by a processor, pattern data. The pattern data comprising areas of variable reflectance intended to be formed on a portion of the object. The method includes determining, by a processor, object generation instructions to apply a fusing agent to at least part of a layer of build material corresponding to the portion of the object in a density corresponding to the reflectance of the generated pattern data.
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公开(公告)号:US11648731B2
公开(公告)日:2023-05-16
申请号:US15763200
申请日:2015-10-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Kristopher J. Erickson , Thomas Anthony , Howard S. Tom , Sivapackia Ganapathiappan , Lihua Zhao , Krzysztof Nauka
IPC: B29C64/00 , B29C64/165 , B33Y50/02 , B33Y10/00 , B33Y70/00 , B33Y80/00 , B29C67/00 , C09B47/06 , C09B47/24 , C09B47/067 , B33Y40/00 , B29C64/40 , B29C64/176 , B29C64/10 , B29C64/182 , B33Y99/00 , B29C64/25 , B33Y40/10 , B33Y50/00 , B29C64/205 , B29C64/307 , B29C64/245 , B33Y40/20 , B29C64/255 , B29C64/30 , B29C64/227 , B22F10/28 , B22F10/50 , B33Y30/00 , B29C64/20 , B29C64/393
CPC classification number: B29C64/165 , B22F10/28 , B22F10/50 , B29C64/00 , B29C64/10 , B29C64/176 , B29C64/182 , B29C64/20 , B29C64/205 , B29C64/227 , B29C64/245 , B29C64/25 , B29C64/255 , B29C64/30 , B29C64/307 , B29C64/393 , B29C64/40 , B29C67/00 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y40/10 , B33Y40/20 , B33Y50/00 , B33Y50/02 , B33Y70/00 , B33Y80/00 , B33Y99/00 , C09B47/065 , C09B47/0678 , C09B47/24 , B22F2999/00 , G03G2215/2054 , G05B2219/49023 , G05B2219/49246 , Y10T156/1722 , Y10T156/1798 , B22F2999/00 , B22F10/10 , B22F1/105 , B22F1/107 , B22F1/054 , B22F2999/00 , B22F1/054 , B22F1/105 , B22F10/10 , B22F1/107 , B22F2999/00 , B22F10/28 , B22F1/06 , B22F1/107 , B22F1/054
Abstract: In an example of a method for forming three-dimensional (3D) printed electronics, a build material is applied. A fusing agent is selectively applied on at least a portion of the build material. The build material is exposed to radiation and the portion of the build material in contact with the fusing agent fuses to form a layer. An electronic agent is selectively applied on at least a portion of the layer, which imparts an electronic property to the at least the portion of the layer.
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公开(公告)号:US11526150B2
公开(公告)日:2022-12-13
申请号:US16076241
申请日:2017-07-28
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Vanessa Verzwyvelt , Matthew A Shepherd , Morgan T Schramm , Andrew E Fitzhugh , Lihua Zhao , Jacob Tyler Wright , Hector Lebron
IPC: G06N5/04 , G05B19/4099 , B33Y50/00
Abstract: In an example, a method includes receiving object model data describing at least a portion of an object to be generated by additive manufacturing. Object generation instructions for generating the object in its entirety may be derived based on the object model data. Where it is determined that the object model data comprises a data deficiency for deriving the object generation instructions, at least one attribute for the object may be inferred and object generation instructions may be derived based on the object model data and the inferred attribute.
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公开(公告)号:US11458679B2
公开(公告)日:2022-10-04
申请号:US15513965
申请日:2014-09-26
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: James Elmer Abbott, Jr. , Alexander Govyadinov , Vladek Kasperchik , Krzysztof Nauka , Sivapackia Ganapathiappan , Lihua Zhao , Howard S. Tom, Jr. , Yan Zhao , Hou T. Ng
IPC: B29C64/165 , B33Y30/00 , B29C64/291 , B29C64/277 , B29C64/264 , B29C64/268 , B29C35/08 , B29C67/00 , B33Y10/00 , B29C64/205 , B29C64/209
Abstract: In one example, a lighting device for an additive manufacturing machine includes an array of light sources each to emit monochromatic light within a band of wavelengths that includes a peak light absorption of a liquid coalescing agent to be dispensed on to a build material.
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公开(公告)号:US11413815B2
公开(公告)日:2022-08-16
申请号:US16076338
申请日:2017-04-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Kristopher J. Erickson , Lihua Zhao
IPC: B29C64/165 , B29C64/295 , B29C64/209 , B29C64/268 , B33Y10/00 , B33Y30/00 , B33Y70/00
Abstract: A system for forming a multiple layer object, the system including: a spreader to form a layer of polymer particles, the polymer particles having a melting temperature (Tm) of at least 250° C.; a fluid ejection head to selectively deposit a first fusing agent on a first portion of the layer and selectively deposit a second fusing agent on a second portion of the layer, wherein the fluid ejection head does not deposit the fusing agent on a third portion of the layer; and a heat source to heat the first portion and second portion, wherein the first portion is part of the multiple layer object and the second portion is not part of the multiple layer object and the second portion raises a temperature of polymer particles in a subsequent layer.
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公开(公告)号:US20220226892A1
公开(公告)日:2022-07-21
申请号:US17311421
申请日:2019-10-11
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Aja Hartman , John Samuel Dilip Jangam , Lihua Zhao
Abstract: A kit for three-dimensional printing a metal object is described. The kit comprises a build material and a shaping composition. The build material comprises metallic particles. The shaping composition comprises a metallic mixture for forming an intermetallic compound with the metallic particles and/or that is exothermically reactive.
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