- 专利标题: MULTILAYER COIL COMPONENT
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申请号: US17486258申请日: 2021-09-27
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公开(公告)号: US20220102038A1公开(公告)日: 2022-03-31
- 发明人: Yusuke NAGAI , Takashi SUZUKI , Kazuhiro EBINA , Kouichi KAKUDA , Kunihiko KAWASAKI , Shinichi KONDO , Shinichi SATO , Seiichi NAKAGAWA , Mitsuharu KOIKE , Kazuhiro MIURA
- 申请人: TDK CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: TDK CORPORATION
- 当前专利权人: TDK CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2020-162223 20200928
- 主分类号: H01F1/28
- IPC分类号: H01F1/28 ; H01F5/00
摘要:
A multilayer coil component includes an element body containing a plurality of metal magnetic particles and a resin existing between the plurality of metal magnetic particles and a coil disposed in the element body and configured to include a plurality of electrically interconnected coil conductors. At least one of the plurality of coil conductors has a spiral shape and has conductor portions adjacent to each other when viewed from a direction along a coil axis of the coil. The conductor portion includes a straight conductor portion extending in a straight line and a connecting conductor portion connecting the straight conductor portion and constituting a corner portion of the coil conductor. The metal magnetic particles between the connecting conductor portions adjacent to each other are lower in density than the metal magnetic particles between the straight conductor portions adjacent to each other.
公开/授权文献
- US12040111B2 Multilayer coil component 公开/授权日:2024-07-16
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