Invention Application
- Patent Title: COIL SUBSTRATE, MOTOR COIL SUBSTRATE, AND MOTOR
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Application No.: US17488769Application Date: 2021-09-29
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Publication No.: US20220110210A1Publication Date: 2022-04-07
- Inventor: Haruhiko MORITA , Hitoshi MIWA , Shinobu KATO , Toshihiko YOKOMAKU , Hisashi KATO , Takahisa HIRASAWA , Tetsuya MURAKI , Takayuki FURUNO
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Ogaki
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki
- Priority: JP2020-169904 20201007
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H02K3/04 ; H05K1/18
Abstract:
A coil substrate includes a first flexible substrate, a coil formed on the first flexible substrate, a second flexible substrate extending from the first flexible substrate, and a wiring that is formed on the second flexible substrate and is electrically connected to the coil formed on the first flexible substrate. The second flexible substrate includes a first portion extending from the first flexible substrate and a second portion extending from the first portion such that the second portion is formed along the first flexible substrate and that the second flexible substrate forms a gap between the second portion and the first flexible substrate.
Information query
