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公开(公告)号：US20220123616A1
公开(公告)日：2022-04-21
申请号：US17450856
申请日：2021-10-14
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko MORITA , Hitoshi MIWA , Shinobu KATO , Toshihiko YOKOMAKU , Hisashi KATO , Takahisa HIRASAWA , Tetsuya MURAKI , Takayuki FURUNO
IPC: H02K3/26
Abstract: A coil substrate includes a flexible substrate having first and second ends, a first coil formed on first surface of the substrate such that the first coil has center space and first wiring surrounding the space, and an second coil formed on second surface of the substrate such that the second coil has center space and second wiring surrounding the space and is positioned directly below the first coil. Each of the first and second wirings has outer and inner ends such that each wiring is formed in spiral shape between the outer and inner ends, a number of turns in the first coil is greater than a number of turns in the second coil, a width of the first wiring is substantially constant from the outer end to the inner end, and a width of the second wiring is not constant from the outer end to the inner end.
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公开(公告)号：US20220078912A1
公开(公告)日：2022-03-10
申请号：US17445750
申请日：2021-08-24
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko MORITA , Hitoshi MIWA , Shinobu KATO , Toshihiko YOKOMAKU , Hisashi KATO , Takahisa HIRASAWA , Tetsuya MURAKI , Takayuki FURUNO
IPC: H05K1/11
Abstract: A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate such that the coils are positioned substantially in a row between the first end and second end of the flexible substrate. The coils are formed such that the number of coils is K and that the coils include the first coil positioned close to the first end and the K-th coil positioned to form a predetermined distance between the K-th coil and the second end, where K is an integer equal to or greater than 2.
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公开(公告)号：US20200075223A1
公开(公告)日：2020-03-05
申请号：US16554883
申请日：2019-08-29
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko MORITA , Hitoshi MIWA , Shinobu KATO , Toshihiko YOKOMAKU , Hisashi KATO , Takahisa HIRASAWA , Tetsuya MURAKI , Takayuki FURUNO
Abstract: A planar transformer includes a flexible insulating substrate having a first surface and a second surface on the opposite side with respect to the first surface, and multiple coils formed side by side on the first surface and the second surface of the flexible insulating substrate such that each of the coils includes a spiral-shaped wiring. The flexible insulating substrate has bending portions formed such that the flexible insulating substrate is folded at the bending portions and stack the coils one another.
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公开(公告)号：US20190387613A1
公开(公告)日：2019-12-19
申请号：US16556292
申请日：2019-08-30
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka TANIGUCHI , Ryuzo NISHIKAWA , Haruhiko MORITA
Abstract: A method for manufacturing a printed wiring board includes laminating a first insulative resin layer including low dielectric constant material on a first surface of a base substrate, forming a first conductive layer including a metal foil on the first insulative resin layer, laminating a second insulative resin layer including prepreg material on a second surface of the base substrate on the opposite side with respect to the first surface, and forming a second conductive layer including a metal foil on the second insulative resin layer. The first insulative resin layer is formed such that a dielectric constant of the first insulative resin layer is set lower than a dielectric constant of the second insulative resin layer.
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公开(公告)号：US20200083769A1
公开(公告)日：2020-03-12
申请号：US16567514
申请日：2019-09-11
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko MORITA , Hitoshi MIWA , Shinobu KATO , Toshihiko YOKOMAKU , Hisashi KATO , Takahisa HIRASWA , Tetsuya MURAKI , Takayuki FURUNO
Abstract: A coil substrate for a motor includes a flexible substrate, and multiple coils formed on a surface of the flexible substrate. Each of the coils has a wiring having first wiring portions and second wiring portions extending from the first wirings respectively and is formed such that the first wiring portions extend parallel with respect to each other and that the second wiring portions extend not parallel to the first wirings, and the flexible substrate is formed to be formed around a magnet of a motor such that the first wiring portions form an angle that is substantially perpendicular to a rotation direction of the motor.
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Patent Agency Ranking
公开(公告)号：US20160217911A1
公开(公告)日：2016-07-28
申请号：US15004030
申请日：2016-01-22
Applicant: IBIDEN CO., LTD.
Inventor： Yasuhiko MANO , Kazuhiro YOSHIKAWA , Haruhiko MORITA , Takashi KARIYA
CPC classification number: H01F27/2804 , H01F27/29 , H01F27/324
Abstract: An inductor component includes a resin insulating layer having an opening portion, a first coil formed on a first surface of the resin insulating layer such that the first coil is surrounding the opening portion, a second coil that is formed on a second surface of the resin insulating layer on the opposite side with respect to the first surface such that the second coil is surrounding opening portion, a via conductor formed through the resin insulating layer such that the via conductor is connecting the first coil and the second coil, and a magnetic body structure having an opening portion magnetic body filling the opening portion of the resin insulating layer, a first surface magnetic body covering the first coil, and a second surface magnetic body covering the second coil.
Abstract translation: 电感器部件包括具有开口部的树脂绝缘层，形成在树脂绝缘层的第一表面上的第一线圈，使得第一线圈围绕开口部，形成在树脂的第二表面上的第二线圈 绝缘层，其相对于第一表面在相对侧上，使得第二线圈围绕开口部分;通孔导体，其形成为穿过树脂绝缘层，使得通孔导体连接第一线圈和第二线圈;以及磁体 具有填充树脂绝缘层的开口部的开口部磁性体，覆盖第一线圈的第一表面磁性体和覆盖第二线圈的第二表面磁性体的结构。
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7.发明申请ELECTRONIC CIRCUIT APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT APPARATUS 审中-公开电子电路设备及制造电子电路设备的方法公开(公告)号：US20150366102A1
公开(公告)日：2015-12-17
申请号：US14737943
申请日：2015-06-12
Applicant: IBIDEN CO., LTD.
Inventor： Teruyuki ISHIHARA , Haruhiko MORITA , Takashi KARIYA
CPC classification number: H05K3/429 , H01L23/367 , H01L2924/0002 , H05K1/0207 , H05K1/0209 , H05K3/4608 , H05K2201/09127 , Y10T29/49126 , Y10T29/49167 , H01L2924/00
Abstract: An electronic circuit apparatus includes a circuit substrate, a heat generating component positioned on the circuit substrate, a metal plate forming a portion of an inner layer of the circuit substrate and protruding from a side surface of the circuit substrate such that the metal plate has an exposed portion exposed to outside the circuit substrate, and an external component connected to the exposed portion of the metal plate and including one of an external heat dissipation component and an external cooling component.
Abstract translation: 电子电路装置包括电路基板，位于电路基板上的发热部件，形成电路基板的内层的一部分的金属板，从电路基板的侧面突出，使得金属板具有 露出部分暴露于电路基板外部，外部部件连接到金属板的暴露部分，并且包括外部散热部件和外部冷却部件之一。
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8.发明申请公开(公告)号：US20150137931A1
公开(公告)日：2015-05-21
申请号：US14603822
申请日：2015-01-23
Applicant: IBIDEN Co., Ltd.
Inventor： Yasuhiko MANO , Kazuhiro YOSHIKAWA , Haruhiko MORITA
CPC classification number: H01F27/2804 , H01F27/24 , H01F41/041 , H01F2027/2809 , Y10T29/4902
Abstract: A printed wiring board includes an insulation layer having a first penetrating hole penetrating through the insulation layer, a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer such that the magnetic core structure including a first magnetic body layer formed in the first penetrating hole is formed through the insulation layer, and a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding a circumference of the magnetic core structure. The magnetic core structure and the inductor pattern of the conductor layer form an inductor device.
Abstract translation: 印刷布线板包括具有穿过绝缘层的第一穿透孔的绝缘层，包括填充在穿过绝缘层的第一穿透孔中的磁性材料的磁芯结构，使得包括形成第一磁性体层的磁芯结构 在第一贯通孔中形成绝缘层，导体层形成在绝缘层上并具有使电感器图案围绕磁芯结构的圆周的电感图案。 导体层的磁芯结构和电感器图案形成电感器件。
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公开(公告)号：US20220115927A1
公开(公告)日：2022-04-14
申请号：US17489972
申请日：2021-09-30
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko MORITA , Hitoshi MIWA , Shinobu KATO , Toshihiko YOKOMAKU , Hisashi KATO , Takahisa HIRASAWA , Tetsuya MURAKI , Takayuki FURUNO
Abstract: A coil substrate includes a flexible substrate having a first end and a second end, and coils formed on the substrate such that the coils extend from the first end to the second end of the substrate. The coils are formed such that each coil includes a center space and a wiring formed around the center space, each coil is formed such that the wiring includes one or more first wirings, one or more second wirings facing the first wiring(s) via the center space, and one or more third wirings connecting the first and second wiring(s) and that the first wiring(s) is positioned closer to the first end than the second wiring(s), and the wiring in each coil is formed such that a width w1 of the first wiring(s), a width w2 of the second wiring(s), and a width w3 of the third wiring(s) are substantially equal to each other.
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公开(公告)号：US20200286678A1
公开(公告)日：2020-09-10
申请号：US16804047
申请日：2020-02-28
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko MORITA , Hitoshi MIWA , Shinobu KATO , Toshihiko YOKOMAKU , Hisashi KATO , Takahisa HIRASAWA , Tetsuya MURAKI , Takayuki FURUNO
Abstract: A planar transformer includes a coil substrate including a flexible substrate and multiple coils formed on the flexible substrate. The coil substrate is formed to have coil parts and coilless parts such that the coil parts have the coils and that the coilless parts do not have the coils, and the coil substrate is folded such that at least one of the coilless parts is sandwiched between two of the coil parts.
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