Invention Application
- Patent Title: Water-Based Anti-Corrosion Cutting Fluid for Electronic Device Housings
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Application No.: US17425146Application Date: 2019-05-09
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Publication No.: US20220119971A1Publication Date: 2022-04-21
- Inventor: Kuan-Ting Wu , Chi Hao Chang , Chienchih Chiu
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- International Application: PCT/US2019/031404 WO 20190509
- Main IPC: C25D1/14
- IPC: C25D1/14 ; C25D13/20 ; C25D13/02 ; H01M50/124

Abstract:
In one example, a method for manufacturing an electronic device housing is described. A coating layer may be formed on a surface of a metal substrate. Further, an edge region of the metal substrate may be chamfered by applying water-based anti-corrosion cutting fluid to form an exposed surface portion of the metal substrate. On the exposed surface portion, a transparent protective passivation layer may be formed. Furthermore, a first electrophoretic deposition layer may be formed on the transparent protective passivation layer.
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