Invention Application
- Patent Title: TOUCH SENSING MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
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Application No.: US17388234Application Date: 2021-07-29
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Publication No.: US20220121340A1Publication Date: 2022-04-21
- Inventor: Hee Sun OH , Gye Won LEE , Hong Seok LEE , Chang Ju LEE , Jong Yun KIM
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0133941 20201016,KR10-2021-0036792 20210322
- Main IPC: G06F3/041
- IPC: G06F3/041 ; G06F3/044 ; H03K17/96
Abstract:
A touch sensing module includes a sensing coil, a metal portion disposed to be spaced apart from the sensing coil, and a first bracket having one surface, on which the metal portion is disposed, and an other surface, opposing the one surface, on which a pad having a capacitance, configured to vary as a touch is applied, is disposed.
Public/Granted literature
- US11775099B2 Touch sensing module and electronic device including the same Public/Granted day:2023-10-03
Information query
