Invention Application
- Patent Title: DEVICE INTEGRATION SCHEMES LEVERAGING A BULK SEMICONDUCTOR SUBSTRATE HAVING A <111> CRYSTAL ORIENTATION
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Application No.: US17072649Application Date: 2020-10-16
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Publication No.: US20220122963A1Publication Date: 2022-04-21
- Inventor: Mark Levy , Jeonghyun Hwang , Siva P. Adusumilli
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/16 ; H01L29/20 ; H01L29/04 ; H01L29/06 ; H01L21/8258

Abstract:
Structures including devices, such as transistors, integrated on a bulk semiconductor substrate and methods of forming a structure including devices, such as transistors, integrated on a bulk semiconductor substrate. The bulk semiconductor substrate contains a single-crystal semiconductor material having a diamond crystal lattice structure and a crystal orientation. A first transistor is formed in a first device region of the bulk semiconductor substrate, and a second transistor is formed in a second device region of the bulk semiconductor substrate. The second transistor includes a layer stack on the bulk semiconductor substrate, and the layer stack includes a layer comprised of a III-V compound semiconductor material.
Public/Granted literature
- US11469225B2 Device integration schemes leveraging a bulk semiconductor substrate having a <111 > crystal orientation Public/Granted day:2022-10-11
Information query
IPC分类: