Invention Application
- Patent Title: HETEROJUNCTION BIPOLAR TRANSISTOR WITH BURIED TRAP RICH ISOLATION REGION
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Application No.: US17075056Application Date: 2020-10-20
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Publication No.: US20220122968A1Publication Date: 2022-04-21
- Inventor: Vibhor JAIN , John J. ELLIS-MONAGHAN , Anthony K. STAMPER , Steven M. SHANK , John J. PEKARIK
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L27/082
- IPC: H01L27/082 ; H01L29/06 ; H01L29/737 ; H01L27/06

Abstract:
The present disclosure relates to semiconductor structures and, more particularly, to heterojunction bipolar transistors (HBTs) with a buried trap rich isolation region and methods of manufacture. The structure includes: a first heterojunction bipolar transistor; a second heterojunction bipolar transistor; and a trap rich isolation region embedded within a substrate underneath both the first heterojunction bipolar transistor and the second heterojunction bipolar transistor.
Public/Granted literature
- US11791334B2 Heterojunction bipolar transistor with buried trap rich isolation region Public/Granted day:2023-10-17
Information query
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