Invention Application
- Patent Title: PRINTED CIRCUIT BOARD
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Application No.: US17144371Application Date: 2021-01-08
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Publication No.: US20220124906A1Publication Date: 2022-04-21
- Inventor: Jae Heun LEE , Yong Soon JANG
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0133219 20201015
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11

Abstract:
A printed circuit board includes an insulating layer and a circuit layer disposed on the insulating layer. The circuit layer includes a first circuit pattern and a second circuit pattern. Each of the first and second circuit patterns has a first side surface, a second side surface opposing the first side surface, and a top surface connected to ends of the first and second side surfaces, when viewed in a cross section direction. The first side surface of the first circuit pattern and the first side surface of the second circuit pattern face each other. A height of the first side surface of the first circuit pattern is greater than a height of the second side surface of the first circuit pattern, and a height of the first side surface of the second circuit pattern is greater than a height of the second side surface of the second circuit pattern.
Public/Granted literature
- US11765820B2 Printed circuit board Public/Granted day:2023-09-19
Information query