公开(公告)号：US20230156922A1

公开(公告)日：2023-05-18

申请号：US17673405

申请日：2022-02-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyun Woo KWON ,  Ki Ran PARK ,  Kyeong Yub JUNG ,  Jin Uk LEE ,  Jae Heun LEE

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/185 ,  H05K1/183 ,  H05K1/112 ,  H05K3/4697

Abstract: A printed circuit board includes: a first insulating layer including a first cavity and a second cavity; a first electronic component disposed in the first cavity and including a first pad disposed in a first surface direction of the first insulating layer; a second electronic component disposed in the second cavity and including a second pad disposed in a second surface direction, facing the first surface direction, of the first insulating layer; a second insulating layer disposed on each of first and second surfaces of the first insulating layer and in the first cavity to cover the first electronic component; and a third insulating layer disposed on the first surface of the first insulating layer and in the second cavity to cover the second electronic component.

公开(公告)号：US20250008659A1

公开(公告)日：2025-01-02

申请号：US18443560

申请日：2024-02-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Heun LEE

IPC: H05K1/16 ,  H05K1/03 ,  H05K1/11

Abstract: The present disclosure relates to a printed circuit board including: a glass layer; a first wiring layer disposed on an upper surface of the glass layer; and a capacitor including a plurality of blind holes penetrating through a portion of the glass layer from an upper surface to a lower surface of the glass layer, respectively, a first electrode layer disposed on the upper surface of the glass layer and extending into each of the plurality of blind holes, a second electrode layer disposed on the first electrode layer and disposed in each of the plurality of blind holes, and a first dielectric layer disposed between the first and second electrode layers.

公开(公告)号：US20220022310A1

公开(公告)日：2022-01-20

申请号：US17204058

申请日：2021-03-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hwa Park ,  Chi Seong Kim ,  Eun Heay Lee ,  Yo Han Song ,  Gun Hwi Hyung ,  Jae Heun LEE ,  Deok Man Kang ,  Jin Oh Park

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/22 ,  H05K3/00

Abstract: A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.

公开(公告)号：US20240422901A1

公开(公告)日：2024-12-19

申请号：US18441422

申请日：2024-02-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Heun LEE

IPC: H05K1/03 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46

Abstract: A printed circuit board includes: a glass layer having a through-hole penetrating between an upper surface and a lower surface thereof; a through-via including a via metal layer disposed on a wall surface of the through-hole and a first insulating material disposed in at least a portion of a space between portions of the via metal layer in the through-hole; a first wiring layer disposed on the upper surface of the glass layer, at least a portion of the first wiring layer connected to an upper side of the through-via; a second wiring layer disposed on the lower surface of the glass layer, at least a portion of the second wiring layer connected to a lower side of the through-via; and a second insulating material covering at least a portion of an external surface of the glass layer. The first and second insulating materials include substantially the same material.

公开(公告)号：US20240164013A1

公开(公告)日：2024-05-16

申请号：US18221001

申请日：2023-07-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Heun LEE ,  Jong Eun PARK ,  Chan Jin PARK ,  Hyun Seok YANG ,  Tae Hee YOO

IPC: H05K1/02 ,  H05K3/18 ,  H05K3/26

CPC classification number: H05K1/0298 ,  H05K3/181 ,  H05K3/26

Abstract: A printed circuit board including a first insulating layer; a plurality of first circuit patterns respectively disposed on the first insulating layer; a second insulating layer disposed on the first insulating layer and covering a portion of a side surface of each of the plurality of first circuit patterns; and an insulator disposed between at least one pair of adjacent first circuit patterns, among the plurality of first circuit patterns, and integrated with the first insulating layer, and a method for manufacturing a printed circuit board, are provided.

公开(公告)号：US20220124906A1

公开(公告)日：2022-04-21

申请号：US17144371

申请日：2021-01-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Heun LEE ,  Yong Soon JANG

IPC: H05K1/02 ,  H05K1/11

Abstract: A printed circuit board includes an insulating layer and a circuit layer disposed on the insulating layer. The circuit layer includes a first circuit pattern and a second circuit pattern. Each of the first and second circuit patterns has a first side surface, a second side surface opposing the first side surface, and a top surface connected to ends of the first and second side surfaces, when viewed in a cross section direction. The first side surface of the first circuit pattern and the first side surface of the second circuit pattern face each other. A height of the first side surface of the first circuit pattern is greater than a height of the second side surface of the first circuit pattern, and a height of the first side surface of the second circuit pattern is greater than a height of the second side surface of the second circuit pattern.