Invention Application
- Patent Title: TIE LAYER CHEMISTRY TO PROMOTE BONDING WITH SILICONE ADHESIVE
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Application No.: US17438724Application Date: 2020-03-13
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Publication No.: US20220127505A1Publication Date: 2022-04-28
- Inventor: Jennifer N. Hanson , Kiu-Yuen Tse , Amanda C. Engler , Pamela A. Percha
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- International Application: PCT/IB2020/052308 WO 20200313
- Main IPC: C09J7/50
- IPC: C09J7/50
Abstract:
The present invention is adhesive article including a tie layer and a silicone adhesive. The tie layer includes a segmented copolymer having a first segment that is one of (a) a polyether comprising one of PTMO or PEO/PPO or (b) a polysiloxane. The segmented copolymer has a water absorbency of less than about 13%.
Public/Granted literature
- US12163071B2 Tie layer chemistry to promote bonding with silicone adhesive Public/Granted day:2024-12-10
Information query
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