Invention Application
- Patent Title: CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
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Application No.: US17406456Application Date: 2021-08-19
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Publication No.: US20220130615A1Publication Date: 2022-04-28
- Inventor: Dong Jun JUNG , Dae Hee LEE , Hyun KIM , Yun KIM
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0137682 20201022,KR10-2021-0054242 20210427
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G4/12 ; H01G4/008 ; C04B35/468

Abstract:
A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of crystal grains and a grain boundary disposed between adjacent crystal grains. A ratio (C2/C1) of an Mg content (C2) of the grain boundary to an Mg content (C1) of at least one of the plurality of crystal grains is 3 or more.
Public/Granted literature
- US11784004B2 Ceramic electronic component and method of manufacturing the same Public/Granted day:2023-10-10
Information query