Invention Application
- Patent Title: Selective Deposition Of A Passivation Film
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Application No.: US17081506Application Date: 2020-10-27
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Publication No.: US20220130660A1Publication Date: 2022-04-28
- Inventor: Andrea Leoncini , Yong Wang , Doreen Wei Ying Yong
- Applicant: Applied Materials, Inc. , National University of Singapore
- Applicant Address: US CA Santa Clara; SG Singapore
- Assignee: Applied Materials, Inc.,National University of Singapore
- Current Assignee: Applied Materials, Inc.,National University of Singapore
- Current Assignee Address: US CA Santa Clara; SG Singapore
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/67
Abstract:
Selective deposition methods are described. An exemplary method comprises exposing the substrate comprising a first surface and a second surface to an anchor reactant and selectively depositing the anchor reactant on the first surface as a seed layer, wherein the anchor reactant comprises an ethynyl derivative with a headgroup that selectively targets the first surface.
Public/Granted literature
- US11515154B2 Selective deposition of a passivation film Public/Granted day:2022-11-29
Information query
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