Invention Application
- Patent Title: WIDENED CONDUCTIVE LINE STRUCTURES AND STAIRCASE STRUCTURES FOR SEMICONDUCTOR DEVICES
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Application No.: US17078201Application Date: 2020-10-23
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Publication No.: US20220130830A1Publication Date: 2022-04-28
- Inventor: Yuichi Yokoyama
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L23/522

Abstract:
Systems, methods, and apparatuses for widened conductive line structures and staircase structures for semiconductor devices are described herein. One memory device includes an array of vertically stacked memory cells, the array including a vertical stack of horizontally oriented conductive lines. Each conductive line comprises a first portion extending in a first horizontal direction and a second portion extending in a second horizontal direction, wherein the second portion of each conductive line is of a width greater than the first portion of each conductive line.
Public/Granted literature
- US11950403B2 Widened conductive line structures and staircase structures for semiconductor devices Public/Granted day:2024-04-02
Information query
IPC分类: