Invention Application
- Patent Title: BATTERY ENCAPSULATION METHOD
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Application No.: US17569016Application Date: 2022-01-05
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Publication No.: US20220131215A1Publication Date: 2022-04-28
- Inventor: Vincent JARRY
- Applicant: STMicroelectronics (Tours) SAS
- Applicant Address: FR Tours
- Assignee: STMicroelectronics (Tours) SAS
- Current Assignee: STMicroelectronics (Tours) SAS
- Current Assignee Address: FR Tours
- Main IPC: H01M50/10
- IPC: H01M50/10 ; H01M10/04 ; H01M6/40 ; H01M50/116 ; H01M50/124 ; H01M50/528 ; H01M50/543

Abstract:
An electronic device includes a base substrate with a mica substrate thereon. A top face of the mica substrate has a surface area smaller than a surface area of a top face of the base substrate. An active battery layer is on the mica substrate and has a top face with a surface area smaller than a surface area of a top face of the mica substrate. An adhesive layer is over the active battery layer, mica substrate, and base substrate. An aluminum film layer is over the adhesive layer, and an insulating polyethylene terephthalate (PET) layer is over the aluminum film layer. A battery pad is on the mica substrate adjacent the active battery layer, and a conductive via extends to the battery pad. A conductive pad is connected to the conductive via. The adhesive, aluminum film, and PET have a hole defined therein exposing the conductive pad.
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